Recommendation for baking of Flex and Rigid-Flex PCBs

Due to the fact that nearly all Flex and Rigid-Flex boards are constructed with polyimide inside and that the polyimide is highly hydroscopic in its form, it is strongly recommended to bake the boards to reduce the amount of moisture inside the boards before any type of soldering operation can take place, otherwise there is big risk of delaminating, broken innerlayer connections or cracked hole walls.
Download the recommendation: Recommendation for baking of Flex and Rigid-Flex PCBs

Recommendation for baking of Rigid PCBs

Download recommendation: Recommendation for baking of Rigid PCBs

NCAB follows the rules and regulations of RoHS and REACH

Download: RoHS official statement
Download: REACH official statement